Member - HYMET Thermal Interfaces
Anisotropic thermal interface materials for cooling high powered, complex and compact electronics.
About
HYMET strives to increase reliability, performance and longevity of electronics while decreasing power consumption, cost of manufacturing and rate of e-waste entering landfills. This is achieved through the introduction of a new category of thermal interface materials (TIMs) with integrated deformable heat spreaders. Our materials occupy a unique market gap, in the field of thermal management in electronics, which has been neglected despite being foundational to the entire semiconductor industry.
Headquarters Riga, LV-1050, Latvia
SDG’s of application
The Sustainable Development Goals are a call to action to end poverty, protect the planet and ensure peace and prosperity everywhere.
SDG 6
Clean water and sanitation
SDG 7
Affordable and clean energy
SDG 9
Industry, innovation and infrastructure
SDG 11
Sustainable cities and communities
SDG 12
Responsible consumption and production
Documents
The information set out above, is solely for the purposes of information and the Solar Impulse Foundation does not provide any guarantee as to its authenticity, completeness or accuracy. To validate the Membership to the World Alliance for Efficient Solutions, the Solar Impulse Foundation only verifies that each entity is registered and has signed our principles and values stated in the following World Alliance for Efficient Solutions charter. For those Members who are also solution providers, this information does not constitute investment advice or a recommendation to buy into, transact or to enter into any agreement with any of the parties or persons mentioned above. Potential investors or interested parties are solely responsible for their investment or business decisions and for performing any due diligence required by the circumstances.
