enScribe™ Product line

Gallery enScribe™ Product line 1
Gallery enScribe™ Product line 1
February 2021
Headquarters 75007 Paris, France

enScribe™ Product line - A solution to reduce the Global Warming Potential (GWP) impact associated with most contemporary gases used in semiconductor manufacturing processes

Fabrication of semiconductor device structures requires several gas-phase processes for controlled growth/removal of materials in order to create specific architectures. Air Liquide developed a new portfolio of advanced etching speciality gases to solve both technological and environmental future challenges in the semiconductor industry. It brings two kinds of advantages to semiconductor customers: not only do they address their new technical challenges for more advanced and complicated device, but they also bring environmental benefits by reducing the overall GWP footprint of their fab.

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Key features

  • Reduces the process time by 50%
  • Improving a-C mask selectivity 3-4 times compared with C4F6
  • A thousand time smaller (1/1000) GWP compared with conventional fluorocarbons (a-C4F8)
  • enScribe™ G1 gas reduces client's fab CO2 emission by 4% - equivalent to the reduction of CO2 emission from 29,000 cars


  • Less than 5 years payback time
  • Improve yield by 10 % compared to mainstream alternative

Categories of Application

Maturity Stage

  • Medium and large scale commercialization
  • Small scale commercialization
  • Initial market commercialization
  • Prototype testing in the real world
  • Prototype testing 1:1 in the lab

Looking For

Activity Region

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